Mhinduro

Kubatanidza waya

PEPA RECHOKWADI CHEHWEZIVO

Chii chinonzi Kubatanidza Waya?

Kubatanidza waya inzira iyo waya yesimbi yakapfava yakareba diki inonamirwa pamusoro pesimbi inoenderana pasina kushandisa solder, flux, uye mune dzimwe nguva nekushandisa kupisa kuri pamusoro pe150 degrees Celsius. Simbi dzakapfava dzinosanganisira Goridhe (Au), Mhangura (Cu), Sirivha (Ag), Aluminium (Al) uye alloys dzakadai sePalladium-Silver (PdAg) nedzimwe.

Kunzwisisa Matekiniki eKubatanidza Waya uye Maitiro eKushandisa Micro Electronics Assembly.
Matekiniki / Maitiro ekubatanidza Wedge: Ribhoni, Thermosonic Ball & Ultrasonic Wedge Bond
Kubatanidza waya inzira yekugadzira kubatana pakati peintegrated circuit (IC) kana semiconductor device yakafanana nepakeji yayo kana leadframe panguva yekugadzira. Inoshandiswawo zvakanyanya pari zvino kupa kubatana kwemagetsi muLithium-ion battery pack assemblies. Kubatanidza waya kunowanzoonekwa senzira inodhura uye inochinjika pane tekinoroji dziripo dze microelectronic interconnect, uye inoshandiswa mumapakeji mazhinji e semiconductor akagadzirwa nhasi. Kune nzira dzakasiyana siyana dzekubatanidza waya, dzinosanganisira: Thermo-Compression Wire Bonding:
Kubatanidza waya neThermo-compression (kusanganisa nenzvimbo dzinogona kuitika (kazhinji Au) pamwe chete pasi pesimba rekusunga rine tembiricha yepamusoro, inowanzo pfuura 300°C, kugadzira weld), kwakatanga kugadzirwa muma1950 yekubatanidza ma microelectronics, zvisinei izvi zvakatsiviwa nekukurumidza neUltrasonic & Thermosonic bonding muma60s se tekinoroji huru yekubatanidza. Kubatanidza kweThermo-compression kuchiri kushandiswa kune niche applications nanhasi, asi kazhinji kunodziviswa nevagadziri nekuda kwetembiricha yepamusoro (inowanzo kuvadza) interface inodiwa kuti pave nebudiriro yekubatana.Ultrasonic Wedge Wire Bonding:
Mumakore ekuma1960, Ultrasonic wedge wire bonding ndiyo yakava nzira huru yekubatanidza. Kushandiswa kwe high frequency vibration (kuburikidza ne resonating transducer) kuchishandiso chekubatanidza ne simba rekusunga panguva imwe chete, kwakaita kuti waya dzeAluminium neGold dzibatanidzwe patembiricha yemumba. Kubata uku kweUltrasonic kunobatsira kubvisa tsvina (oxides, tsvina, nezvimwewo) kubva panzvimbo dzekubatanidza pakutanga kwe bonding cycle, uye mukusimudzira kukura kwe intermetallic kuti iwedzere kukura nekusimbisa bonding. Ma frequency akajairika ekubatanidza i60 - 120 KHz. Nzira ye ultrasonic wedge ine matekinoroji maviri makuru ekugadzirisa: Kubata waya hombe (kurema) kwewaya dze >100µm dhayamita Kubata waya kwakanaka (diki) kwewaya dze <75µm dhayamita Mienzaniso ye typical Ultrasonic bonding cycles inogona kuwanikwa pano yewaya yakanaka uye pano yewaya hombe. Ultrasonic wedge wire bonding inoshandisa chishandiso chekubatanidza chakati kana "wedge," chinowanzo gadzirwa kubva kuTungsten Carbide (yewaya yeAluminium) kana Titanium Carbide (yewaya yeGoridhe) zvichienderana nezvinodiwa nemaitiro uye dhayamita dzewaya; Zvidimbu zveceramic zvakaiswa pamativi ekushandisa zvakasiyana zviripowo. Kubatanidza waya yethermosonic:
Kana paine kudiwa kwekuwedzera kupisa (kazhinji kune waya yeGoridhe, ine ma bonding interfaces ari pakati pe100 - 250°C), maitiro aya anonzi Thermosonic wire bonding. Izvi zvine zvakanakira zvikuru kupfuura system yechinyakare ye thermo-compression, sezvo tembiricha shoma dze interface dzichidiwa (Au bonding patembiricha yemumba yataurwa asi mukuita kwayo hazvivimbike kana pasina kupisa kwakawedzerwa). Thermosonic Ball Bonding:
Imwe nzira yekubatanidza waya yeThermosonic ndeyeBall Bonding (ona bhora rekubatanidza pano). Iyi nzira inoshandisa chishandiso checeramic capillary bonding pamusoro pemagadzirirwo ekare ewedge kuti ibatanidze hunhu hwakanakisa mu thermo-compression uye ultrasonic bonding pasina zvipingamupinyi. Kutenderera kweThermosonic kunoita kuti tembiricha yeinterface irambe yakaderera, nepo kubatana kwekutanga, bhora rebhora rakamanikidzwa nethermally rinobvumira waya ne secondary bond kuiswa kune chero divi, kwete kuenderana ne first bond, inova dhimandi mu Ultrasonic wire bonding. Pakugadzira otomatiki, vhoriyamu yakawanda, mabhora ekubatanidza anokurumidza kupfuura ma Ultrasonic / Thermosonic (Wedge) bonders, zvichiita kuti Thermosonic ball bonding ive tekinoroji inotonga yekubatanidza mu microelectronics kwemakore anopfuura makumi mashanu apfuura. Ribbon Bonding:
Kubatanidza ribhoni, uchishandisa matepi esimbi akatsetseka, kwave kuri kukuru muRF neMicrowave electronics kwemakumi emakore (ribhoni ichipa kuvandudzwa kukuru mukurasikirwa kwechiratidzo [ganda] zvichienzaniswa newaya yakatenderera yechinyakare). Ribhoni diki dzegoridhe, dzinowanzo kusvika paupamhi hwe75µm uye ukobvu hwe25µm, dzinobatanidzwa kuburikidza neThermosonic process nechinhu chikuru chekubatanidza wedge chakatsetseka. Ribhoni dzealuminium dzinosvika 2,000µm neupamhi hwe250µm dzinogonawo kusungirirwa neUltrasonic wedge process, sezvo chinodiwa che lower loop, high density interconnects chakawedzera.

Chii chinonzi waya yekubatanidza yegoridhe?

Kubatanidza waya yegoridhe inzira iyo waya yegoridhe inosungirirwa panzvimbo mbiri mugungano kuti igadzire kubatana kana nzira inofambisa magetsi. Kupisa, ma ultrasound, uye simba zvese zvinoshandiswa kugadzira nzvimbo dzekubatanidza waya yegoridhe. Maitiro ekugadzira nzvimbo yekubatanidza anotanga nekuumbwa kwebhora regoridhe pamucheto wechishandiso chekubatanidza waya, capillary. Bhora iri rinodzvanywa pamusoro pemusangano unopisa uku uchishandisa simba rakatarwa uye frequency ye60kHz - 152kHz yekufamba kwe ultrasonic nechishandiso. Kana chisungo chekutanga chagadzirwa, waya ichagadziriswa nenzira yakanyatsodzorwa kuti igadzire chimiro chakakodzera che geometry yemusangano. Chisungo chechipiri, chinowanzonzi stitch, chinozogadzirwa pane imwe nzvimbo nekudzvanya pasi newaya uye kushandisa clamp kubvarura waya pamubatanidzwa.

Kubatanidza waya dzegoridhe kunopa nzira yekubatanidza mukati memapakeji anotungamira magetsi zvakanyanya, anenge akakura kupfuura mamwe ma solders. Pamusoro pezvo, waya dzegoridhe dzinoshivirira kuoxidation zvakanyanya kana tichienzanisa nezvimwe zvinhu zvewaya uye dzakapfava kupfuura dzakawanda, izvo zvakakosha kune nzvimbo dzinonzwa kutonhora.
Maitiro acho anogonawo kusiyana zvichienderana nezvinodiwa nekubatanidzwa. Nezvinhu zvinonzwa, bhora regoridhe rinogona kuiswa panzvimbo yechipiri yekubatanidza kuti pave nechisungo chakasimba uye chisungo "chakapfava" kudzivirira kukuvara pamusoro pechikamu. Nenzvimbo dzakamanikana, bhora rimwe chete rinogona kushandiswa senzvimbo yekutanga yezvisungo zviviri, zvichigadzira chisungo chakaita se "V". Kana chisungo chewaya chichifanira kuva chakasimba, bhora rinogona kuiswa pamusoro pechisungo kuti pave nechisungo chekuchengetedza, zvichiwedzera kugadzikana uye simba rewaya. Mashandisirwo akasiyana-siyana uye kusiyana kwekubatanidza waya hazvina muganho uye zvinogona kuitwa kuburikidza nekushandisa software otomatiki paPalomar's wire bond systems.